SinePulse Electrical Package Designer

SinePulse is an emerging company in the field of IT, Radio Frequency and Embedded System engineering. SinePulse has business and development center in different countries keeping head office in Munich, Germany. SinePulse is going to launch off-shore development center in Dhaka, Bangladesh to boost up research activities in the field of smart technologies for the future.
Job descriptions: 

You will be responsible for the development of our new chip/package co-design flow for leadframe packages, which bridges the gap between mechanical CAD (package design environment in AutoCAD) and electrical CAD (chip design environment in Cadence Virtuoso or Cadence Encounter), including connectivity entry, physical layout design of the leadframe and the bonding diagram, DRC, LVS, and the link to electrical and thermal simulation of the complete system of chip and package.

Required skills: 
  • 1+ years experience in AutoCAD
  • Experience with Candence tool
  • Knowledge on semiconductor chip packaging technology is desired.
  • Experience with 3D modeling and simulation (e.g. FEM tools like Ansys Q3D, HFSS) is desirable.
Language Requirement: 
English: very good, German: not mandatory but good to have
Place of work: 
Munich, Germany
Based on Experience
Starting date: 
As soon as possible
No. of Positions: 

Tania Rahman
SinePulse GmbH

Kistlerhofstr. 170, 81379 Munich, Germany.

Tel: +49 (0) 89/17959921

Job Nature: 
Full Time

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